Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
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Job Description:
Der Standort Teltow entwickelt und fertigt elektronische Komponenten, die hauptsächlich auf der Surface Acoustic Wave (SAW)-Technologie basieren. Die meisten Produkte sind kundenspezifisch. Unser Standort umfasst Produktionsbereiche mit verschiedenen Reinraumklassen für den Front-End-Bereich (Wafer-Produktion) und den Back-End-Bereich (Montage).
Sie berichten an den Manager SAW Manufacturing und sind Teil des Backend-Teams.
Was macht diese Stelle so attraktiv?
In dieser Position werden Sie mit der Montage von SAW-Komponenten betraut. Sie bedienen modernste Halbleiteranlagen.
Weitere Details zu den Erwartungen und Aufgaben dieser Position:
Arbeiten mit Arbeitsanweisungen und Prüfvorschriften gemäß dokumentierten ProzessenMontage von Komponenten (SAW-Filter und Oszillatoren)Bedienung von Maschinen für die Chipmontage und verschiedene VerbindungsprozesseAuftragstransfers innerhalb des ERP-Systems
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The Teltow site develops and manufactures electronic components based mainly on Surface Acoustic Wave (SAW) technology. Most of the products are customer-specific. Our site includes production areas with different clean room classes for the front-end (wafer production) and back-end (assembly) areas.
Reporting to the Manager SAW Manufacturing you will be part of the backend team.
What’s attractive about this opportunity?
This position will expose you to assemble SAW components. You will operate state of the art semiconductor equipment.
More details on the expectations and responsibilities in this position:
Work with work instructions and inspection requirements in accordance with documented processesAssembly of components (SAW filters and oscillators)Operation of machines for chip assembly and various connection processesTransfer jobs within the ERP system
Requirements/Qualifications:
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Qualifikation/Anforderungen
Schulabschluss mindestens 10. KlasseVorzugsweise eine Ausbildung in Elektronik, Physik oder FeinmechanikErfahrung in einem vergleichbaren Beruf
Kompetenzen
Interesse an technischen Themen, gutes Verständnis für technische ProzesseSorgfältige ArbeitsweiseErfahrung in der Elektronikfertigung und in der Frontend- oder Backend-Fertigung sind willkommenEinige Erfahrung im Umgang mit Software (um Testsoftware in das Produktionsplanungssystem laden zu können)Gute Deutschkenntnisse sind erforderlichUmfassende Schulungen werden garantiertWeiterführende Weiterbildungsmöglichkeiten werden angeboten
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Qualification/Requirements
School graduation at least grade 10Preferably some education in electronics or physics or precise mechanicsExperience in comparable profession
Competencies
Interest in technical subjects, good understanding of technical processesAccurate work executionExperience in electronic manufacturing and in front end or backend manufacturing are welcomeSome experience in software handling (to be able to load test software into the production planning system)Good command of German language is requiredComprehensive training and education are guaranteedFurther qualification possibilities are offered
Travel Time:
No Travel
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